Technology and Design (IC Design, Failure Analysis and Reliability) Singapore University of Technology and Design

Overview

This Technology and Design (IC Design, Failure Analysis and Reliability) programme from Singapore University of Technology and Design aims to give students an all-encompassing knowledge and experience in the fields of semiconductor device technologies and architectures, digital integrated circuit design, semiconductor materials analysis, device and integrated circuit reliability and failure analysis for production yield improvement. 

Developed in collaboration with Wintech-Nano Technology, a leading expert in semiconductor chip analysis and testing, the programme offers a standout feature: a two-month internship during the final term at Wintech’s cutting-edge facilities in Suzhou, China. This extraordinary opportunity allows students to learn through practical engagement, preparing students effectively for your future career in the semiconductor domain.

Possible career paths and opportunities

• Career prospects for graduates from the programme include:
• process engineers in the semiconductor fabrication industry;
• integrated circuit design engineers in IC design industry;
• failure and reliability test engineers in semiconductor failure analysis for yield improvement;
• research and development engineers in relevant fields of semiconductor.